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hsme-cxxx alingap green chipled data sheet caution: hsme-cxxx leds are class 1a esd sensitive per jesd22-a114c.01. please observe appropriate precautions during handling and processing. refer to application note an-1142 for additional details. avagofreservesfthefrightftofalterfprices,fspecifcation,ffeatures,fcapabilities,ffunctions,freleasefdates,fandfremovefavailabilityfoffthefproduct(s)fatfanytime. features ? f smallfsizef ? f industryfstandardffootprint ? f operatingftemperaturefrangefoffC40 cftof+85 cf ? f compatiblefwithfirfsoldering ? f availablefinf8fmmftapefonf7fdiameterfreel ? f reelfsealedfinfzip-lockedfmoisturefbarrierfbags applications ? f membranefswitchfindicator ? f lcdfbacklighting ? f pushbuttonfbacklighting ? f frontfpanelfindicator ? f symbolfbacklighting ? f keypadfbacklighting description thisf chip-typef ledf utilizesf aluminumf indiumf galliumf phosphidef (alingap)f materialf technology.f thef alingapf materialf hasf af veryf highf luminousf efciency,f capablef off producingfhighflightfoutput. thesef chipledsf comef inf topf mounting,f topf emittingf packagesf(hsmx-c150/170/177/190/191/197),ftopfmoun- ting,fsidefemittingfpackagesf(hsmx-c110/120)forfreversef mounting,ftopfemittingfpackagef(hsmx-c265). allfpackagesfarefbinnedfbyfbothfcolorfandfintensity. inf orderf tof facilitatef pickf andf placef operation,f thesef chipledsfarefshippedfinftapef&freel,fwithf4000funitsfperf reelfforfhsmx-c120/170/f177/190/191/197fandf3000funitsf perfreelfforfhsmx-c110/c150/265. thesef packagesf aref compatiblef withf refowf solderingf process. hsme-c110/c120/c150/c170/c177/c190/ c191/c197/c265
2 hsmx-c191 1.6 (0.063 ) 0.3 (0.012) 0.3 0.15 (0.012 0.006) 0.3 (0.012) polarity cathode mark 0.6 (0.023) 0.3 0.15 (0.012 0.006) 1.0 (0.039) diffused epoxy pc board soldering terminal 0.8 (0.031) cathode line 0.7 (0.028) min. 1.6 (0.063 ) 0.3 (0.012) 0.3 0.15 (0.012 0.006) 0.3 (0.012) polarity cathode mark 0.8 (0.031) 0.3 0.15 (0.012 0.006) 1.0 (0.039) diffused epoxy pc board soldering terminal 0.8 (0.031) cathode line 0.7 (0.028) min. hsmx-c190 2.00 (0.079 ) 0.30 (0.012) 0.40 0.15 (0.016 0.006) 0.30 (0.012) polarity 0.80 (0.031) 0.40 0.15 (0.016 0.006) 1.40 (0.055) diffused epoxy pc board soldering terminal 1.25 (0.049) cathode line hsmx-c170 cathode mark 3.2 (0.126 ) 0.5 (0.020) 0.8 (0.031) polarity cathode line 1.5 (0.059) led die clear epoxy pc board soldering terminal 1.0 (0.039) 1.0 (0.039) 2.6 (0.102 ) 1.6 (0.063 ) cathode line hsmx-c110 3.2 (0.126 ) package dimensions notes: 1.f allfdimensionsfinfmillimetersf(inches). 2.f tolerancefisff0.1fmmf(f0.004fin.)funlessfotherwisefspecifed.
hsmx-c120 1.6 (0.063) 0.5 (0.020) polarity cathode mark 1.0 (0.039) 3 ? 0.3 (0.012) 1.2 (0.047) 0.3 (0.012) led die clear epoxy pc board soldering terminal 0.6 (0.024) cathode line 0.80 (0.031) 1.60 (0.063) diffused epo xy pc bo ard 0.40 (0.016) 0.16 (0.006) 0.70 (0.028) min. 0.30 0.15 (0.012 0.006) ca thode line ca thode mark hsmx-c197 polarity soldering terminal 3.2 (0.126 ) 0.5 (0.020) 0.5 0.2 (0.020 0.008) 0.6 (0.024) polarity cathode mark 1.1 (0.043) 0.5 0.2 (0.020 0.008) 2.0 (0.079) diffused epoxy pc board soldering terminal 1.6 (0.063) cathode line hsmx-c150 3.40 (0.134) 0.30 (0.012) 2? 1.10 (0.043) polarity cathode mark (etched) 1.10 (0.043) 2? 0.50 0.15 (0.020 0.006) 1.20 (0.047) led die undiffused epoxy pc board 1.25 (0.049) cathode line hsmx-c265 notes: 1.f allfdimensionsfinfmillimetersf(inches). 2.f tolerancefisff0.1fmmf(f0.004fin.)funlessfotherwisefspecifed. package dimensions, continued
ca thode mark 1.25 (0.049) 2.00 (0.079) diffused epo xy pc bo ard 0.40 (0.016) 0.16 (0.006) 0.40 0.15 (0.016 0.006) soldering terminal hsmx-c177 1.10 (0.043) polarity ca thode line package dimensions, continued notes: 1.f allfdimensionsfinfmillimetersf(inches). 2.f tolerancefisff0.1fmmf(f0.004fin.)funlessfotherwisefspecifed.
device selection guide package dimension (mm) [1,2] alingap green package description 1.6f(l)fxf0.8f(w)fxf0.6f(h) hsme-c191 untinted,fdifused 1.6f(l)fxf0.8f(w)fxf0.4f(h) hsme-c197 untinted,fdifused 1.6f(l)fxf0.8f(w)fxf0.8f(h) hsme-c190 untinted,fdifused 2.0f(l)fxf1.25f(w)fxf0.8f(h) hsme-c170 untinted,fdifused 2.0f(l)fxf1.25f(w)fxf0.4f(h) hsme-c177 untinted,fdifused 1.6f(l)fxf1.0f(w)fxf0.6f(h) hsme-c120 untinted,fnon-difused 3.2f(l)fxf1.5f(w)fxf1.0f(h) hsme-c110 untinted,fnon-difused 3.2f(l)fxf1.6f(w)fxf1.1f(h) hsme-c150 untinted,fdifused 3.4f(l)fxf1.25f(w)fxf1.1f(h) HSME-C265 untinted,fnon-difused notes: 1.f dimensionsfinfmm. 2.f toleranceff0.1fmmfunlessfotherwisefnoted. absolute maximum ratings at t a = 25c parameter hsme-c110/120/170/177/ 190/191/197/150/265 units dcfforwardfcurrent f[1,2] 20 ma powerfdissipation 52 mw reversefvoltagef(i r f=f100f a) 5 v ledfjunctionftemperature 95 c operatingftemperaturefrange C40ftof+85 c storageftemperaturefrange C40ftof+85 c solderingftemperature seefrefowfsolderingfproflef(figuresf6f&f7) notes: 1.ff derateflinearlyfasfshownfinffiguref4. 2.ff drivefcurrentfabovef5fmafisfrecommendedfforfbestflongftermfperformance. electrical characteristics at t a = 25c part number forward voltage v f (volts) @ i f = 20 ma reverse breakdown v r (volts) @ i r = 100 a capacitance c (pf), v f = 0, f = 1 mhz thermal resistance r jCpin (c/w) typ. max. min. typ. typ. hsme-c110/120 2.1 2.6 5 18 550 hsme-c150/170/177/190/191/197 2.1 2.6 5 15 450 HSME-C265 2.1 2.6 5 16 450
optical characteristics at t a = 25c part number luminous intensity i v (mcd) @ 20 ma [1] peak wavelength peak (nm) color, dominant wavelength d [2] (nm) viewing angle 2 1/2 degrees [3] luminous efcacy v (lm/w) min. typ. typ. typ. typ. typ. hsme-c110 18 52 570 572 130 570 hsme-c120 18 52 570 572 155 570 hsme-150/170/f 190/191 18 50 570 572 170 570 f hsme-c177/197 18 50 570 572 130 570 HSME-C265 18 50 570 572 150 570 notes: 1.f thefluminousfintensity,fi v ,fisfmeasuredfatfthefpeakfoffthefspatialfradiationfpattern,fwhichfmayfnotfbefalignedfwithfthefmechanicalfaxisfofftheflampf package. 2.f thefdominantfwavelength,f d ,fisfderivedffromfthefciefchromaticallyfdiagramfandfrepresentsfthefperceivedfcolorfoffthefdevice. 3.f 1/2 fisfthefof-axisfanglefwherefthefluminousfintensityfisf1/2fthefpeakfintensity. light intensity (i v ) bin limits [1] bin id intensity (mcd) min. max. a 0.11 0.18 b 0.18 0.29 c 0.29 0.45 d 0.45 0.72 e 0.72 1.10 f 1.10 1.80 g 1.80 2.80 h 2.80 4.50 j 4.50 7.20 k 7.20 11.20 l 11.20 18.00 m 18.00 28.50 nf 28.50 45.00 p 45.00 71.50 q 71.50 112.50 r 112.50 180.00 s 180.00 285.00 t 285.00 450.00 u 450.00 715.00 tolerance:ff15% green color bin limits [1] bin id dom. wavelength (nm) min. max. a 561.5 564.5 b 564.5 567.5 c 567.5 570.5 d 570.5 573.5 e 573.5 576.5 tolerance:ff1fnm notes: 1.ff binfcategoriesfarefestablishedfforfclassifcationfoffproducts.fproductsfmayfnotfbefavailablefinfallfcategories.fpleasefcontactfyourfavagofrepresentativef forfinformationfonfcurrentlyfavailablefbins. 2.ff thefivfbinningfspecifcationfset-upfisfforflowestfallowablefivfbinningfonly.ftherefarefnofupperfivfbinflimits.
figure 5a. relative intensity vs. angle for hsmx-c170, hsmx-c190, hsmx-c191, and hsmx-c150. figure 4. maximum forward current vs. ambient temperature. figure 3. luminous intensity vs. forward current. figure 1. relative intensity vs. wavelength. figure 2. forward current vs. forward voltage. figure 5b. relative intensity vs. angle for hsmx-c177 and hsmx-c197. 100 50 0 400 450 550 600 650 700 relative intensity ? % wavelength - nm 90 80 70 60 40 30 20 10 500 hsme-c110 fig 1 100 10 1 0.1 1.5 1.9 2.2 v f ? forward voltage ? v i f ? forward current ? ma 1.7 hsme-c110 fig 2 2.0 1.6 1.8 2.1 05 15 i f ? forward current ? ma 0 0.4 1.0 1.2 luminous intensity (normalized @ 20 ma ) hsme-c110 fig 3 30 0.6 0.2 0.8 10 20 25 0 0 20 60 80 100 5 i f max. ? maximum forward current ? ma t a ? ambient temperature ? c 40 hsme-c110 fig 4 20 15 25 10 10 30 50 70 90 hsme-c110 fig 5a relative intensity ? % 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 02 03 05 07 09 0 -90 -20 -80 -60 -40 -10 10 40 60 80 hsme-c110 fig 5b relative intensity ? % 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 02 03 05 07 09 0 -90 -20 -80 -60 -40 -10 10 40 60 80
figure 5c. relative intensity vs. angle for hsmx-c110. figure 5d. relative intensity vs. angle for hsmx-c120. hsme-c110 fig 5c-1 relative intensity ? % 100 0 angle 40 20 60 80 02 0 100 -100 -20 -80 -60 -40 40 60 80 hsme-c110 fig 5c-2 relative intensity ? % 100 0 angle 40 20 60 80 02 0 100 -100 -20 -80 -60 -40 40 60 80 hsme-c110 fig 5d-1 relative intensity ? % 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 02 03 05 07 09 0 -90 -20 -80 -60 -40 -10 10 40 60 80 100 90 80 70 60 50 40 30 20 10 0 relative intensity -90 -80 -70 -60 -50 -40 -30 -20 -10 01 02 03 04 05 06 07 08 09 0 angle hsme-c110 fig 5d-2
1.5 (0.059) 1.5 (0.059) 1.5 (0.059) 2.0 (0.079) hsme-c110 fig 12 230c max. 10 sec. max. 4c/sec. max. over 2 min. time temperature 4c/sec. max. 140-160c ?3c/sec. figure 6. recommended refow soldering profle. figure 5e. relative intensity vs. angle for hsmx-c265. figure 8. recommended soldering pattern for hsmx-c265. figure 9. recommended soldering pattern for hsmx-c120. figure 10. recommended soldering pattern for hsmx-c110. figure 11. recommended soldering pattern for hsmx-c170 and hsmx-c177. figure 12. recommended soldering pattern for hsmx-c190, hsmx-c191 and hsmx-c197. figure 13. recommended soldering pattern for hsmx-c150. figure 7. recommended pb-free refow soldering profle. hsme-c110 fig 5e relative intensity ? % 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 02 03 05 07 09 0 -90 -20 -80 -60 -40 -10 10 40 60 80 note: 1.f allfdimensionsfinfmillimetersf(inches). 217 c 200 c 60 - 120 sec. 6 c/sec. max. 3 c/sec. max. 3 c/sec. max. 150 c 255 - 260 c 100 sec. max. (acc. to j-std-020c) 10 - 30 sec. time tempera ture 1.25 (0.049) 1.4 (0.055) 1.4 (0.055) 2.3 (0.091) hsme-c110 fig 7 2.2 (0.087) dia. pcb hole 0.7 (0.028) 0.8 (0.031) 0.8 (0.031) 1.2 (0.047) 0.4 (0.016) 0.15 (0.006) hsme-c110 fig 8 0.4 (0.016) centering board 5.0 (0.200) 1.0 (0.039) 1.5 (0.059) 1.5 (0.059) 2.0 (0.079) 0.9 (0.035) 0.2 (0.008) hsme-c110 fig 9 0.9 (0.035) centering board 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) 1.2 (0.047) hsme-c110 fig 10 0.8 (0.031) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) hsme-c110 fig 11
figure 15. reel dimensions. figure 14. reeling orientation. x x x x x x x x x x x x x x x x x x x x cathode side printed label user feed direction x x x x x 10.50 1.0 (0.413 0.039) 59.60 1.00 (2.346 0.039) ? 20.20 min. (? 0.795 min.) 6 ps 178.40 1.00 (7.024 0.039) 3.0 0.5 (0.118 0.020) 4.0 0.5 (0.157 0.020) 5.0 0.5 (0.197 0.020) ? 13.1 0.5 (? 0.516 0.020) 8.0 1.0 (0.315 0.039) note: 1.f allfdimensionsfinfmillimetersf(inches).
figure 16. tape dimensions. 8.00 0.30 (0.315 0.012) user feed direction dim. a (see table 1) 3.50 0.05 (0.138 0.002) 1.75 (0.069) dim. c (see table 1) 0.20 0.05 (0.008 0.002) carrier tape cover tape dim. b (see table 1) 4.00 (0.157) 2.00 0.05 (0.079 0.002) 4.00 (0.157) 1.50 (0.059) table 1 dimensions in millimeters (inches) cathode dim. a 0.10 ( 0.004) dim. b 0.10 ( 0.004) part number dim. c 0.10 ( 0.004) hsmx-c170 series 2.30 (0.091) 1.45 (0.057) 0.95 (0.037) hsmx-c190 series 1.75 (0.069) 0.90 (0.035) 0.90 (0.035) hsmx-c110 series 3.40 (0.134) 1.70 (0.067) 1.20 (0.047) hsmx-c191 series 1.86 (0.073) 0.89 (0.035) 0.87 (0.034) hsmx-c150 series 3.50 (0.138) 1.88 (0.074) 1.27 (0.050) hsmx-c110/c120 position in carrier tape dim. b (see table 1) dim. a (see table 1) hsmx-c110 r 1.0 0.05 (0.039 0.002) hsmx-c120 r 0.5 0.05 (0.020 0.002) hsmx-c120 series 1.90 (0.075) 1.15 (0.045) 0.80 (0.031) hsmx-c197 series 1.75 (0.069) 0.95 (0.037) 0.60 (0.024) hsmx-c177 series 2.30 (0.091) 1.40 (0.055) 0.60 (0.024) 8.00 0.30 (0.315 0.012) user feed direction dim. a (see table 1) 3.50 0.05 (0.138 0.002) 1.75 (0.069) dim. c (see table 1) 0.20 0.05 (0.008 0.002) carrier tape cover tape dim. b (see table 1) 4.00 (0.157) 2.00 0.05 (0.079 0.002) 4.00 (0.157) 1.50 (0.059) hsmx-c265 series 3.70 (0.146) 1.45 (0.057) 1.30 (0.051) table 1 dimensions in millimeters (inches) cathode dim. a 0.10 (0.004) dim. b 0.10 (0.004) part number dim. c 0.10 (0.004) notes: 1.f allfdimensionsfinfmillimetersf(inches). 2.f tolerancefisff0.1fmmf(f0.004fin.)funlessfotherwisefspecifed.
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2010 avago technologies. all rights reserved. av02-0976en - may 10, 2010 convective ir refow soldering forf moref informationf onf soldering,f referf tof applicationf notef 1060,f surface mounting smt led indicator components . storage condition: 5 to 30c @ 60% rh max. bakingf isf requiredf underf thef condition: a)f humidityf indicatorf cardf isf >10%f whenfreadfatf23ff5c b)ff devicef exposedf tof factoryf condi - tionsf <30c/60%f rhf moref thanf 672fhours. bakingf recommendedf condition:f f 60ff5 cfforf20fhours. figure 17. tape leader and trailer dimensions. end start there shall be a minimum of 160 mm (6.3 inch) of empty component pockets sealed with cover tape. mounted with components there shall be a minimum of 160 mm (6.3 inch) of empty component pockets sealed with cove r tape. minimum of 230 mm (9.05 inch) may consist of carrier and/or cover tape .

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